Heat Sink for Power Transistor-2 MCQ’s

Analog Electronic Circuits Electronics & Communication Engineering

This set of Analog Electronic Circuits Multiple Choice Questions & Answers (MCQs) focuses on “Heat Sink for Power Transistor-2″.

1. The performance of heat sink does not depend upon ___________
a) Choice of material
b) Protrusion design
c) Surface treatment
d) None of the mentioned

2. What is a heat spreader?
a) An older version of a heat sink
b) Another name for heat sink
c) Device to transfer heat from device to the sink
d) A connector for coolant to flow

3. Which of the following heat sink is used for low power application?
a) Stamped heat sink
b) Machining heat sink
c) Aluminum heat sink
d) Bolded-Fin heat sink

4. Heat dissipation from heat sink take place primarily by ___________
a) Conduction
b) Convection
c) Radiation
d) All of the mentioned

5. Heat sinks are usually provided with black anodized finish to ___________
a) Enhance heat dissipation by radiation
b) Enhance heat dissipation by convection
c) Prevent electrical connection
d) Remove dust accumulation

6. De-rating factor is usually expressed in ___________
a) W/°C
b) °C/W
c) W/s
d) kW/K

7. Heat sinks are provided with peripheral fins to ___________
a) Provide good appearance
b) Increase heat absorption
c) Increase surface area of heat dissipation
d) Provide material stability

8. Which substance is used to maintain electrical insulation between a heat sink and transistor?
a) plastic
b) fiber
c) ceramic
d) mica

9. Cavities embedded in heat source is also known as ___________
a) Low sink
b) Sink hole
c) On-sink
d) Inverted sink

10. By dividing volumetric thermal resistance by required thermal resistance we will obtain ___________
a) Power dissipation of heat sink
b) Volume of heat sink
c) Maximum temperature of heat sink
d) Volume of surrounding air

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