Transistor case and Heat Sinks MCQ’s

Electronic Devices & Circuits Electronics & Communication Engineering

This set of Electronic Devices & Circuits Multiple Choice Questions & Answers (MCQs) focuses on “Transistor case and Heat Sinks”.

1. Heat sinks work through the process of _______
a) resistive heat transfer
b) conductive and convection heat transfer
c) active process
d) no heat transfer

2. Copper has around twice the thermal conductivity of aluminum.
a) True
b) False

3. Why does the heat sink has fins?
a) to provide cooling to the processor
b) to provide airflow to the radiator
c) to preserve the energy
d) to provide radiator to the airflow

4. Fin efficiency is increased by_______
a) Using insulating material
b) Decreasing the fin aspect ratio
c) Using more conductive material
d) Decreasing the fin aspect ratio & Using more conductive material

5. How can a pin fin heat sink be classified on the basis of fin arrangements?
a) Pin, straight pin, flared pin
b) Pin, circular pin, cylindrical pin
c) Straight pin, circular pin, isotopic pin
d) No classification

6. Which of the following is not an application of transistor heat sinks?
a) Soldering
b) Light Emitting Diode Lamps
c) Microprocessor Cooling
d) Environment Monitoring Systems

7. How can one decrease the spreading resistance in the base of the heat sink?
a) Increase the base thickness.
b) Decrease the base thickness.
c) Choosing a material with less conductivity.
d) There is no possible way.

8. _______are usually utilized to extract heat from a variety of heat generating bodies to a heat sink.
a) square fins
b) cylindrical fins
c) cavities
d) no option

9. The epoxy bond between the heat sink and component is __________
a) Temporary
b) Loosened
c) Permanent/semi-permanent
d) Highend

10. Which of the following characteristics makes passive heat sinks differently from active heat sinks?
a) It possess mechanical components
b) It possess electrical components
c) Does not possess mechanical components
d) It possess electrical & mechanical components

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